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Vacuum Lamination
Multilayer
printed circuit boards are made up of thin, double-sided boards that are bonded together
and then processed as a single board. The bonding process is called lamination.
Today's preferred lamination process is vacuum lamination. In this process, board
components are bonded in a vacuum under pressure and temperature. PTI's process uses
vacuum frames that allow the lamination package to be held under vacuum both prior to and
during lamination. This permits complete removal of the solvents released during the
bonding process, and allows the lamination to take place under reduced pressures. The
result is a more uniform and stress-free printed circuit board.
